The microelectronics industry is currently undergoing revolutionary change
that has propelled a move towards 3D Heterogeneous Integration (3DHI), a complex new approach that stacks chip components in 3D space instead of on the traditional flat plane that has been in use since the 1980s. While this change promises faster, more efficient, and smaller chips across a variety of applications like 5G/6G, sensors, and medical technology, it presents new challenges in topics such as device packaging, thermal management, and power delivery that the industry is not currently equipped to address.