Electrochemical Additive Manufacturing (ECAM)

ECAM is the future of chip research and development.

This innovative approach employs a process of electrodeposition to directly form intricate 3D microstructures in a electrolyte solution. This process is entirely additive and fundamentally operates in 3D spaces, which is very different from traditional chip manufacturing methods.

Current chip manufacturing is running into physical limitations keeping chips from improving on pace with previous years. Future innovations will soon require fundamental innovations in the way chips are designed and manufactured. 

Microelectronics are everywhere. Over $580B worth of semiconductors are sold every year. Your car alone has on average over 1,000 chips in it.

This technology has been tried and tested across multiple research grants. A physical prototype has already been built and proven, through the creation of multiple pillar and curved structures. 

Technology with huge potential

Learn more about how ECAM is revolutionizing the way chips are manufactured: